Signal isolation structures for em communication

ABSTRACT

Methods, systems, and apparatus for EM isolation structures. One of the apparatus includes a communication module, the communication module including: a printed circuit board; a plurality of integrated circuit packages, each integrated circuit package including at least one transmitter, receiver, or transceiver; and one or more metallic blocking structures configured to at least partially encircle a corresponding one of the plurality of integrated circuit packages, wherein each metallic blocking structure is configured to reduce signal leakage from the corresponding integrated circuit package.

BACKGROUND

This specification relates to electromagnetic communications.

Advances in semiconductor manufacturing and circuit design technologieshave enabled the development and production of integrated circuits (ICs)with increasingly higher operational frequencies. In turn, electronicproducts and systems incorporating high frequency integrated circuitsare able to provide greater functionality than previous generations ofproducts. The additional functionality has typically included theprocessing of increasingly larger amounts of data at increasingly higherspeeds.

Many conventional electronic systems include multiple printed circuitboards (PCBs) upon which ICs are mounted, and through which varioussignals are routed to and from the ICs. The need to communicateinformation between PCBs in electric systems with at least two PCBs haveled to the development of a variety of connector and backplanearchitectures to facilitate information flow between PCBs. However,conventional connector and backplane architectures typically introduce avariety of impedance discontinuities into the signal path, obstructingtransmission, and resulting in a degradation of signal quality orintegrity. Connecting to PCBs by conventional means, e.g.,signal-carrying mechanical connectors, generally createsdiscontinuities, requiring expensive electronics to negotiate.Conventional mechanical connectors may also wear out over time, requireprecise alignment and manufacturing methods, and are susceptible tomechanical jostling.

Signal isolation between different communication links is typicallynecessary in contactless communications to maintain signal quality.Conventional techniques for signal isolation include separation byfrequency, time, code, polarization, and/or space.

SUMMARY

In general, one innovative aspect of the subject matter described inthis specification can be embodied in apparatus that include acommunication module, the communication module including: a printedcircuit board; multiple integrated circuit packages, each integratedcircuit package including at least one transmitter, receiver, ortransceiver; and one or more metallic blocking structures configured toat least partially encircle a corresponding one of the multipleintegrated circuit packages, wherein each metallic blocking structure isconfigured to reduce signal leakage from the corresponding integratedcircuit package. Other embodiments of this aspect include correspondingsystems and methods.

The foregoing and other embodiments can each optionally include one ormore of the following features, alone or in combination. In particular,one embodiment includes all the following features in combination. Themultiple integrated circuit packages include one or more transmitterintegrated circuit packages, one or more receiver integrated circuitpackages, or one or more transceiver integrated circuit packages. Eachof the multiple integrated circuit packages are positioned on a surfaceof the printed circuit board and wherein the spacing between eachintegrated circuit package is specified based on the reduced signalleakage provided by the one or more metallic blocking structures. Theone or more metallic blocking structures each form a channel for passingelectromagnetic signals. One of the metallic blocking structures isshaped to direct signal propagation in a specified direction. Themetallic blocking structure is shaped to partially cover a portion ofthe integrated circuit package. The partial coverage of the integratedcircuit package provides an open channel above a transducer of theintegrated circuit package. The partial coverage of the integratedcircuit package is provided by an asymmetrical horn shape. The partialcoverage of the integrated circuit package is provided by a symmetricalhorn shape. Each signal blocking structure is configured to reducecross-talk between integrated circuit packages.

In general, one innovative aspect of the subject matter described inthis specification can be embodied in apparatus that include acommunication module, the communication module including: a printedcircuit board; multiple integrated circuit packages, each integratedcircuit package including at least one transmitter, receiver, ortransceiver; and one or more absorber structures configured to at leastpartially encircle a corresponding one of the multiple integratedcircuit packages, wherein each absorber structure is configured toreduce signal leakage from the corresponding integrated circuit package.Other embodiments of this aspect include corresponding systems andmethods.

The foregoing and other embodiments can each optionally include one ormore of the following features, alone or in combination. In particular,one embodiment includes all the following features in combination. Theplurality of integrated circuit packages includes one or moretransmitter integrated circuit packages, one or more receiver integratedcircuit packages, or one or more transceiver integrated circuitpackages. Each of the multiple integrated circuit packages arepositioned on a surface of the printed circuit board and wherein thespacing between each integrated circuit package is specified based onthe reduced signal leakage provided by the one or more absorberstructures. The communication module further comprises: multiple signalguiding structures, each signal guiding structure sounding at least aportion of a corresponding integrated circuit package. An absorberstructure of the one or more absorber structures surrounds acorresponding signal guiding structure of the multiple signal guidingstructures. The absorber structure has a varying thickness. The absorberstructure is shaped to partially cover a portion of a correspondingintegrated circuit package.

In general, one innovative aspect of the subject matter described inthis specification can be embodied in apparatus that include acommunication module, the communication module including multipleintegrated circuit packages, each integrated circuit package includingat least one transmitter, receiver, or transceiver; a housing, whereinthe housing is configured to enclose a the communication module; and oneor more metallic blocking structures configured to at least partiallyencircle a corresponding one of the multiple integrated circuitpackages, wherein each metallic blocking structure is configured toreduce signal cross talk between integrated circuit packages. Otherembodiments of this aspect include corresponding systems and methods.

In general, one innovative aspect of the subject matter described inthis specification can be embodied in apparatus that include acommunication module, the communication module including multipleintegrated circuit packages, each integrated circuit package includingat least one transmitter, receiver, or transceiver; a housing, whereinthe housing is configured to enclose a the communication module; and oneor more absorber structures configured to at least partially encircle acorresponding one of the multiple integrated circuit packages, whereineach absorber structure is configured to reduce signal leakage from thecorresponding integrated circuit package. Other embodiments of thisaspect include corresponding systems and methods.

The subject matter described in this specification can be implemented inparticular embodiments so as to realize one or more of the followingadvantages. The isolation structures can reduce cross-talk betweencommunication channels having a small separation distance. Consequently,the overall package footprint of a communication module can beminimized. Isolation structures can be used to preserve preservefrequency spectrum and avoid time-sharing, which allows for faster datatransfer. The shielding against stray signals provided by the disclosedisolation structures are effective, simple, easy to integrate, and arelow cost.

The details of one or more embodiments of the invention are set forth inthe accompanying drawings and the description below. Other features,objects, and advantages of the invention will be apparent from thedescription and drawings, and from the claims.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is an overhead view of an example IC package.

FIG. 2 shows a side view representation of an example communicationdevice including an IC package.

FIG. 3 is a side view of an example communication module including asignal guiding structure.

FIG. 4 is a side view diagram illustrating an example of communicationbetween a transmitter and a receiver.

FIG. 5A shows a side view diagram illustrating a first example metallicsignal isolation structure.

FIG. 5B shows a top view diagram illustrating the first example metallicsignal isolation structure of FIG. 5A.

FIG. 6 shows a side view diagram illustrating a second example metallicsignal isolation structure.

FIG. 7 shows a side view diagram illustrating a third example metallicsignal isolation structure.

FIG. 8A shows a side view diagram illustrating a first example absorbersignal isolation structure.

FIG. 8B shows a top view diagram illustrating the first example absorbersignal isolation structure of FIG. 8A.

FIG. 9A shows a side view diagram illustrating a second example absorbersignal isolation structure.

FIG. 9B shows a top view diagram illustrating the second exampleabsorber signal isolation structure of FIG. 9A.

FIG. 10A shows a side view diagram illustrating a third example absorbersignal isolation structure.

FIG. 10B shows a top view diagram illustrating the third exampleabsorber signal isolation structure of FIG. 10A.

FIG. 11 shows a side view diagram illustrating a fourth example absorbersignal isolation structure.

FIG. 12 shows a perspective view diagram illustrating a fourth examplemetallic signal isolation structure.

FIG. 13 shows a side view diagram illustrating a fifth example metallicsignal isolation structure.

Like reference symbols in the various drawings indicate like elements.

DETAILED DESCRIPTION

This specification describes electromagnetic (EM) isolation structuresfor contactless communication. In particular, this specificationdescribes the use of signal isolation structures to guide signals andreduce cross-talk between communication channels. This specificationdescribes both metallic and absorber structures that can be used toisolate signals that might otherwise interfere with each other, e.g.,between communication channels. The signal isolation structures are usedto reduce cross talk between communication channels while minimizing thephysical spacing between the channels.

Contactless communication may be used to provide signal communicationsbetween components on a device or may provide communication betweendevices. In one example, tightly-coupled transmitter/receiver pairs maybe deployed with a transmitter disposed at a terminal portion of a firstconduction path and a receiver disposed at a terminal portion of asecond conduction path. The transmitter and receiver may be disposed inclose proximity to each other depending on the strength of thetransmitted energy, and the first conduction path and the secondconduction path may not be contiguous with respect to each other. Insome examples, the transmitter and receiver may be disposed on separatecircuit carriers positioned with transducers (e.g., one or moreantennas) of the transmitter/receiver pair in close proximity.

A transmitter, receiver, or transceiver may be configured as anintegrated circuit (IC) package, in which one or more transducers may bepositioned adjacent to a die and held in place by a dielectric orinsulating encapsulation or bond material. A transducer may also be heldin place by a lead frame substrate. Examples of transducers embedded inIC packages are shown in the drawings and described below. Note that ICpackages may also be referred to as simply packages, and are examples ofcontactless communication units that are also variously referred to ascommunication units, communication devices, comm-link chips, comm-linkchip assemblies, comm-link chip packages, and/or comm-link packages,which may be configured in various ways. For example, IC packages,communication units, communication devices, comm-link chips, comm-linkchip assemblies, comm-link chip packages, and/or comm-link packages mayeach include one or more ICs, chips, or dies and have circuitfunctionality appropriate for particular applications.

FIG. 1 shows an example IC package 100. The IC package 100 includes adie 102 and a transducer 104 providing conversion between electrical andEM signals. The IC package 100 may include additional structures, forexample, conductive connectors, such as bond wires, electricallyconnecting the transducer to bond pads connected to a transmitter and/orreceiver circuit included in die 102. The IC package 100 furtherincludes an encapsulating material 106 formed around at least a portionof the die 102 and/or the transducer 104. In the example IC package 100,the encapsulating material 104 completely covers the die 100 and thetransducer 104.

The die 102 includes any suitable structure configured as a circuit on asuitable die substrate. In some implementations, the die canalternatively be referred to as a chip or an integrated circuit. The diesubstrate may be composed of any suitable semiconductor material, forexample, silicon. In some implementations, the die 102 has a length anda width dimension each of substantially 1.0 mm to about 2.0 mm. The die102 may be mounted with electrical conductors, such as a lead frame, notshown in FIG. 1, electrically coupling the die 102 to one or moreexternal circuits. The IC package 100 can further include a transformerto provide impedance matching between a circuit on the die 102 and thetransducer 104.

The transducer 104 may be in the form of a folded dipole or loop antennaand is configured to transmit and/or receive electromagnetic signals. Insome implementations, the transducer 104 is configured to operate atradio frequencies including radio frequencies in the extremely highfrequency (EHF) band of the electromagnetic spectrum, e.g., frequenciesfrom 30 to 300 gigahertz. As shown in IC package 100, the transducer 104is separate from the die 102, but is coupled to the die 102 by suitableconductors, not shown.

The dimensions of the transducer are determined such that they aresuitable for operation in the specified frequency band of theelectromagnetic spectrum, e.g., the EHF band.

In one example, a loop configuration of the transducer can be configuredto include a substantially 0.1 mm band of material, laid out in a loopsubstantially 1.4 mm long and substantially 0.53 mm wide, with a gap ofsubstantially 0.1 mm at the mouth of the loop, and with the edge of theloop approximately 0.2 mm from the edge of die 102.

The encapsulating material 106 can be used to assist in holding thevarious components of IC package 100 in fixed relative positions. Theencapsulating material 106 may be formed from a suitable materialconfigured to provide electrical insulation and physical protection forthe components of IC package 100. Additionally, the encapsulatingmaterial 106 can be selected from a material that does not impede, orthat optimizes passage of, signals to or from the transducer 104. Forexample, the encapsulating material 106 can be composed of glass,plastic, or ceramic. The encapsulating material 106 may also be formedin any suitable shape. For example, the encapsulating material 106 maybe in the form of a rectangular block, encapsulating all components ofthe IC package 100 except for any unconnected ends of conductorsconnecting the die 102 to external circuits.

FIG. 2 shows a side view representation of an example communicationdevice 200 including an IC package 202 mounted to a PCB 204. The ICpackage 202 includes a die 206, a ground plane 208, a transducer 210,and one or more bond wires 212 connecting the die 206 to the transducer210. The die 206 and transducer 210 are mounted on a package substrate214 and encapsulated in an encapsulating material. The ground plane 208is within the package substrate 214 and is a suitable structureconfigured to provide an electrical ground for the transducer 210. Theground plane 208 can extend the entire length of the package substrate214 or just a portion, in particular, a portion underneath thetransducer 210. The PCB 204 includes a top dielectric layer 216 having asurface 218. The IC package 202 is mounted to the surface 218 withmounting bumps 220 attached to a metallization pattern (not shown).

The PCB 204 also optionally includes a layer 222 spaced from dielectriclayer 216 made of conductive material forming a ground plane within thePCB 204. The PCB ground plane may be any suitable structure configuredto provide an electrical ground to circuits and components on the PCB204.

FIG. 3 is a side view of an example communication module 300 including asignal guiding structure. As shown in FIG. 3, the communication module300 includes a PCB 302, an IC package 304, and a signal guidingstructure 306 providing a signal pathway. The communication module 300,can include a transmitter or receiver for transmitting or receivingsignals, e.g., radio frequency signals.

In particular, the IC package 304 can correspond to the IC packagesdescribed above with respect to FIGS. 1 and 2. The IC package 304 ismounted on the PCB 302. For example, the IC package 304 can be mountedto the PCB as described with respect to FIG. 2.

The communication module 300 can be configured to transmit or receivedata using radio frequency communication. For example, if thecommunication module 300 includes a transmitter, the communicationmodule 300 can transmit data, which can then be received by a receiver,e.g., of another communication module.

The signal guiding structure 306 is configured to aid in directing radiofrequency (RF) signals as well as to reduce interference from spurioussignals. The signal guiding structure 306 can surround a perimeter ofthe IC package and extend in the direction of signal transmission and/orreception by a specified amount to provide a channel for emitted orreceived RF signals. For example, the signal guiding structure 306 canhave a height 310 suitable for a particular device including thecommunication module 300 and that allows the signal guiding structure306 to be positioned in proximity to a corresponding signal guidingstructure of another communication module when used to communicate withanother device. The height of the signal guiding structure 306 relativeto the PCB 302 can be configured such that when the communication module300 is positioned the signal guiding structure 306 is proximal to anexternal device housing. The signal guiding structure can be composed ofa suitable material that is configured to reduce extraneous signalswithout disrupting passage of communications along the channel formed bythe signal guiding structure 306.

FIG. 3 illustrates one IC package 304 mounted to the PCB 302. However,in other implementations, more than one IC package can be mounted to thesame PCB 302. For example, a linear array of two or more IC packages,each having a corresponding signal guiding structure, are mounted to asingle PCB.

The communication module 300 can be part of a communication system of adevice, e.g., a computer, mobile phone, tablet, kiosk, or otherdevice/system. The communication system can be configured to providecontactless communication using one or more IC packages. For example,the communication system can include two IC packages, one configured asa transmitter and the other configured as a receiver. The communicationsystem can be in communication with a storage device. Thus, for example,the communication system can transfer data between the data storage unitand an external device using contactless communication provided by theIC packages.

FIG. 4 is a side view diagram 400 illustrating an example ofcommunication between a transmitter (Tx) and a receiver (Rx). Forexample, a user of a first device may wish to exchange data with asecond device. The two devices can be positioned in proximity to eachother such that the respective communication modules for transmittingand receiving data are aligned and in range of each other. Inparticular, for EHF frequencies, the transmitter and receiver of the twodevices may need to be within specified distances. The distances canvary, for example, depending on the particular frequencies used, thematerials between the transmitter and receiver, and the strength of thetransmission.

In FIG. 4, a first device includes a first communication module having atransmitter IC package 402 positioned on a first PCB 404. Thetransmitter IC package 402 is surrounded by a first signal guidingstructure 406 forming a channel. The first signal guiding structure 406extends to a surface of a first housing 408 of the first device. Forexample, the first device can be a first mobile phone and the firsthousing 408 can correspond to the outer case of the first mobile phone.

A second device includes a second communication module having a receiverIC package 410 positioned on a second PCB 412. The receiver IC package410 is surrounded by a second signal guiding structure 414 forming achannel. The second signal guiding structure 414 extends to a surface ofa second housing 416 of the second device. For example, the seconddevice can be a second mobile phone and the second housing 416 cancorrespond to the outer case of the second mobile phone. The signalguiding structures can be formed of metallic or metallic lined wallsthat surround the IC package 410.

As illustrated by diagram 400, the first signal guiding structure 406and the second signal guiding structure 414 are aligned and an outersurface of the first housing 408 and the second housing 416 are inphysical contact to provide optimal communication distance andinterference.

A data transmission from the transmitter IC package 402 passes throughthe channel formed by the first signal guiding structure 406 and thesecond signal guiding structure 414 to the receiver IC package 410. Forexample, a pair of devices can communicate data between each other bytransmitting data from the transmitter IC package 402 to the receiver ICpackage 410. The signal guiding structures along with proper alignmentcan maximize the power of the transmission that is received by thereceiver IC package. In some implementations, the signal guidingstructures can be formed from, or include a layer of, a metallicmaterial that reflects the transmitted data along the signal guidingstructures toward the receiver. In some other implementations, thesignal guiding structures can be formed from, or include a layer of, anelectromagnetic absorbing material to reduce stray signals that maycause interference.

Although transmitted signals from a transmitter are intended for receiptby a particular receiver, cross talk caused by leaking of signals toanother channel can result in unintended coupling that interferes withcommunication on that other channel. With small spacing betweencommunication channels, e.g., between integrated circuit packages,mechanical structures can be used to isolate signals that may otherwiseinterfere with each other. The following figures describe examplestructures for reducing signal leakage allowing for small spacingbetween communication channels.

Metallic Structures

FIG. 5A shows a side view diagram 500 illustrating a first examplemetallic signal isolation structure. In particular, for ease ofillustration a portion of a communication module is shown having asingle integrated circuit package and positioned relative to a housing.In operation, the communication module can have one or more integratedcircuit packages positioned on a common PCB. The communication modulecan be positioned within a device relative to a device housing such thatsignals can pass through the housing. The device can be positionedrelative to another device to communicate data, e.g., as illustrated inFIG. 4.

As shown in diagram 500, an IC package 502, for example a transmitter ICpackage, is positioned on a PCB 504. The IC package 502 is at leastpartially encircled by a metallic outfit 506. The metallic outfit 506forms a channel extending from the PCB 504 to a surface of a housing508. For example, the housing 508 can be the housing portion of a devicesuch as portion of a mobile phone case.

In some implementations, the housing portion 508 includes a portionformed from a different material than other portions of the housingportion 508. For example, the housing portion 508 can be primarilyformed of a metallic material that would inhibit passage ofelectromagnetic signals to or from the IC package. The metallic materialcan also cause signals to be confined within the channel so that minimalsignal energy is dissipated outside of the communication link. A portionof the housing portion 508 that is in a transmission path of signals toor from the IC package 502 can be made of a different material such asplastic that allows for transmission of the signals.

The metallic outfit 506 functions as a signal guiding structure that isconfigured to aid in directing radio frequency (RF) signals as well asto reduce interference from spurious signals. The metallic outfit 506can at least partially surround a perimeter of the IC package 502 andextend in the direction of signal transmission and/or reception by aspecified “height” relative to the PCB 504 to provide a channel foremitted or received RF signals.

The metallic outfit 506 can be shaped to aid in reflecting signal energyand directing signal propagation in a specified direction. Inparticular, the metallic outfit makes a substantially right angle afterrising to a particular height above the IC package 502. From the height,the metallic outfit extends over a portion of the IC package 502 suchthat only a portion is open as a channel to the housing 508. Oppositethe overhang, the metallic outfit forms a side wall to the housingportion 508 that is substantially perpendicular to the PCB 504. In somealternative implementations, the side walls of the metallic outfit canhave a specified angle from perpendicular to the PCB 504, e.g., +/−30degrees. The open portion can be positioned over a transducer of the ICpackage 502, e.g., a loop antenna. In alternative implementations, theoverhanging portion of the metallic outfit can have an angle up towardthe housing or down toward the IC package. Additionally, portions of themetallic outfit 506 can have a curved shape instead of linear segments.

FIG. 5B shows a top view diagram 510 illustrating the first examplemetallic signal isolation structure of FIG. 5A. In particular, diagram510 shows metallic outfit 506 covering a portion of the IC package 502,leaving a region over a transducer 512 open. Thus, the IC package 502 ismostly enclosed by the metallic outfit 506 except for the open channelportion.

FIG. 6 shows a side view diagram 600 illustrating a second examplemetallic signal isolation structure. In particular, for ease ofillustration a portion of a communication module is shown having asingle integrated circuit package and positioned relative to a housing.In operation, the communication module can have one or more integratedcircuit packages positioned on a common PCB. The communication modulecan be positioned within a device relative to a device housing such thatsignals can pass through the housing. The device can be positionedrelative to another device to communicate data, e.g., as illustrated inFIG. 4.

As shown in diagram 600, an IC package 602, for example a transmitter ICpackage, is positioned on a PCB 604. The IC package 602 is at leastpartially encircled by a metallic outfit 606. The metallic outfit 606forms a channel extending from the PCB 604 to a surface of a housing608. For example, the housing 608 can be the housing portion of a devicesuch as portion of a mobile phone case.

In some implementations, the housing portion 608 includes a portionformed from a different material than other portions of the housingportion 608. For example, the housing portion 608 can be primarilyformed of a metallic material that would inhibit passage ofelectromagnetic signals to or from the IC package 602. A portion of thehousing portion 608 that is in a transmission path of signals to or fromthe IC package 602 can be made of a different material such as plasticthat allows for transmission of the signals.

The metallic outfit 606 functions as a signal guiding structure that isconfigured to aid in directing radio frequency (RF) signals as well asto reduce interference from spurious signals. The metallic outfit 606can at least partially surround a perimeter of the IC package 602 andextend in the direction of signal transmission and/or reception by aspecified “height” relative to the PCB 604 to provide a channel foremitted or received RF signals, e.g., similar to the metallic outfit506. The metallic outfit can be used for IC packages having atransmitter as well as IC packages having a receiver. For example, theangle of the metallic horn shown in FIG. 6 can provide a more gradualtransition between large (device housing side) and small apertures (sidecloser to the IC package). The more gradual transition, as opposed to anabrupt one, can provide better performance because discontinuitiesgenerally diffract RF energy.

The metallic outfit 606 can be shaped to aid in reflecting signal energyand directing signal propagation in a specified direction. Inparticular, the metallic outfit makes a substantially right angle afterrising to a particular height above the IC package 602. From the height,the metallic outfit extends over a portion of the IC package 602 suchthat only a portion is open as a channel to the housing 608. Oppositethe overhang, the metallic outfit forms a sidewall to the housingportion 608 that is substantially perpendicular to the PCB 604. Theoverhang forms an asymmetrical horn shape that angles back in theopposite direction and toward the housing portion 608. The open portioncan be positioned over a transducer of the IC package 602. Inalternative implementations, the overhanging portion of the metallicoutfit can have an angle up toward the housing or down toward the ICpackage 602 instead of a right angle compared to the sidewall.

FIG. 7 shows a side view diagram 700 illustrating a third examplemetallic signal isolation structure. In particular, for ease ofillustration a portion of a communication module is shown having asingle integrated circuit package and positioned relative to a housing.In operation, the communication module can have one or more integratedcircuit packages positioned on a common PCB. The communication modulecan be positioned within a device relative to a device housing such thatsignals can pass through the housing. The device can be positionedrelative to another device to communicate data, e.g., as illustrated inFIG. 4.

As shown in diagram 700, an IC package 702, for example a transmitter ICpackage, is positioned on a PCB 704. The IC package 702 is at leastpartially encircled by a metallic outfit 706. The metallic outfit 706forms a channel extending from the PCB 704 to a surface of a housing708. For example, the housing 708 can be the housing portion of a devicesuch as portion of a mobile phone case.

In some implementations, the housing portion 708 includes a portionformed from a different material than other portions of the housingportion 708. For example, the housing portion 708 can be primarilyformed of a metallic material that would inhibit passage ofelectromagnetic signals to or from the IC package 702. A portion of thehousing portion 708 that is in a transmission path of signals to or fromthe IC package 702 can be made of a different material such as plasticthat allows for transmission of the signals.

The metallic outfit 706 functions as a signal guiding structure that isconfigured to aid in directing radio frequency (RF) signals as well asto reduce interference from spurious signals. The metallic outfit 706can at least partially surround a perimeter of the IC package 702 andextend in the direction of signal transmission and/or reception by aspecified “height” to provide a channel for emitted or received RFsignals.

The metallic outfit 706 can be shaped to aid in reflecting signal energyand directing signal propagation in a specified direction. Inparticular, the metallic outfit makes a substantially right angle afterrising to a particular height above the IC package 702 from at least twosides of the IC package 702. From the height, the metallic outfitextends from each respective side of one or more sides and over aportion of the IC package 702 such that only a portion is open as achannel to the housing 708. The overhang thus forms symmetrical hornsthat angle back in the opposite direction and toward the housing portion708. The open portion can be positioned over a transducer of the ICpackage 702. In alternative implementations, the overhanging portion ofthe metallic outfit can have an angle up toward the housing or downtoward the IC package 702.

FIGS. 6 and 7 illustrate cross sections along a particular plane.However, the respective metallic outfits illustrated in the exampleviews can include structures on other sides not illustrated by thecross-section. For example, instead of a single or double horn shape,the metallic outfit can include a horn on any number of sidessurrounding the IC package. An example three sided horn metallic outfitis shown in FIG. 12. An example two sided horn metallic outfit is shownin FIG. 13.

In FIG. 12, a perspective view diagram 1200 illustrates a fourth examplemetallic signal isolation structure. As shown in diagram 1200, an ICpackage 1202, for example a transmitter IC package, is positioned on aPCB 1204. The IC package 1202 is at least partially encircled by ametallic outfit 1206. The metallic outfit 1206 forms a channel extendingfrom the PCB 1204 to a surface of a housing (not shown).

The metallic outfit 1206 can at least partially surround a perimeter ofthe IC package 1202 and extend in the direction of signal transmissionand/or reception by a specified “height” to provide a channel foremitted or received RF signals. The metallic outfit 1206 can be shapedto aid in reflecting signal energy and directing signal propagation in aspecified direction. In particular, the metallic outfit makes asubstantially right angle after rising to a particular height above theIC package 1202 from at least three sides of the IC package 1202illustrated by portions 1208, 1210, and 1212.

From the height, the metallic outfit extends from each respective sideof the three sides and over a portion of the IC package 1202 such thatonly a portion is open as a channel to the housing. The three overhangportions are shown as joined together forming a continuous overhangaround three sides of the metallic outfit 1206. In some implementations,an overhang portion can be included on the fourth side. The overhangangles back in the opposite direction similar to the metallic outfitsshown in FIGS. 6 and 7. Although straight lines and right angles areillustrated in diagram 1200, the metallic outfit 1206 can include one ormore curved or angled segments in place of linear segments.

In FIG. 13, a side view diagram 1300 illustrates a fifth examplemetallic signal isolation structure. As shown in diagram 1300, an ICpackage 1302, for example a transmitter IC package, is positioned on aPCB 1304. The IC package 1302 is at least partially encircled by ametallic outfit 1306. The metallic outfit 1306 forms a channel extendingfrom the PCB 1304 to a surface of a housing (not shown).

The metallic outfit 1306 can at least partially surround a perimeter ofthe IC package 1302 and extend in the direction of signal transmissionand/or reception by a specified “height” to provide a channel foremitted or received RF signals. The metallic outfit 1306 can be shapedto aid in reflecting signal energy and directing signal propagation in aspecified direction. In particular, the metallic outfit makes asubstantially right angle after rising to a particular height above theIC package 1302 from at least three sides of the IC package 1302.However, in contrast to the metallic outfit of FIG. 7, the two sides areadjacent rather than opposite, illustrated by portions 1308 and 1310.

From the height, the metallic outfit extends from each respective sideof the two adjacent sides and over a portion of the IC package 1302 suchthat only a portion is open as a channel to the housing. The adjacentoverhangs 1308 and 1310 of the metallic outfit 1306 angle back in theopposite direction similar to the metallic outfits shown in FIGS. 6 and7. Although straight lines and right angles are illustrated in diagram1300, the metallic outfit 1306 can include one or more curved or angledsegments in place of linear segments.

Absorber Structures

FIG. 8A shows a side view diagram 800 illustrating a first exampleabsorber signal isolation structure. FIG. 8B shows a top view diagram801 illustrating the first example absorber signal isolation structureof FIG. 8A.

In particular, for ease of illustration a portion of a communicationmodule is shown having a single integrated circuit package andpositioned relative to a housing. In operation, the communication modulecan have one or more integrated circuit packages positioned on a commonPCB. The communication module can be positioned within a device relativeto a device housing such that signals can pass through the housing. Thedevice can be positioned relative to another device to communicate data,e.g., as illustrated in FIG. 4.

As shown in diagram 800, an IC package 802, for example a transmitter ICpackage, is positioned on a PCB 804. The IC package 802 is at leastpartially encircled by an absorbing outfit 810. The absorbing outfit 810forms a channel extending from the IC package 802 to a surface of ahousing portion 808.

The absorbing outfit 810 is configured to aid in directing radiofrequency (RF) signals as well as to reduce interference from spurioussignals. For example, the absorbing outfit 810 can be shaped to aid inreflecting signal energy and directing signal propagation in a specifieddirection. The absorbing outfit 810 can at least partially surround aperimeter of the IC package and extend in the direction of signaltransmission and/or reception by a specified “height” to provide achannel for emitted or received RF signals.

The absorbing outfit 810 can be positioned relative to communicationunits, e.g., an IC package, to absorb signals that might otherwise causecrosstalk to adjacent channels. In some implementations, the absorbingoutfit is placed around each IC package on a communication modulewhether it is a transmitter, or receiver.

In FIGS. 8A-8B, the absorbing outfit 810 forms an absorptive wall aroundthe IC package 802. In particular, in the example of FIGS. 8A-B, theabsorbing outfit 810 can be positioned on the PCB 804 encircling the ICpackage 802 and extending substantially to a surface of the housingportion 808. The absorbing outfit 810 is formed from a material thatabsorbs electromagnetic radiation, particularly radio frequencyelectromagnetic radiation including EHF RF electromagnetic radiation.For example, the absorbing outfit 810 can be composed of a silicone,epoxy or other injection-molded plastic (not silica or silicon) withferrite or iron particle loading. In some implementations, the materialis further selected based on heat tolerance properties. For example, thematerial can be selected based in part on a melting or deformation pointin excess of temperatures generated by device components. The absorbingoutfit 810 can have a thickness configured to optimize the amount ofstray signal absorption and may depend on the particular absorbingmaterial used and the proximity to another communication channel.

FIG. 9A shows a side view diagram 900 illustrating a second exampleabsorber signal isolation structure. FIG. 9B shows a top view diagram901 illustrating the second example absorber signal isolation structureof FIG. 9A.

For ease of illustration a portion of a communication module is shownhaving a single integrated circuit package and positioned relative to ahousing. In operation, the communication module can have one or moreintegrated circuit packages positioned on a common PCB. Thecommunication module can be positioned within a device relative to adevice housing such that signals can pass through the housing. Thedevice can be positioned relative to another device to communicate data,e.g., as illustrated in FIG. 4.

As shown in diagram 900, an IC package 902, for example a transmitter ICpackage, is positioned on a PCB 904. The IC package 902 is at leastpartially encircled by an absorbing outfit 910. The absorbing outfit 910forms a channel extending from the IC package 902 to a surface of ahousing portion 908.

The absorbing outfit 910 is configured to aid in directing radiofrequency (RF) signals as well as to reduce interference from spurioussignals. The absorbing outfit 910 can at least partially surround aperimeter of the IC package and extend in the direction of signaltransmission and/or reception by a specified “height” to provide achannel for emitted or received RF signals.

The absorbing outfit 910 forms an absorptive wall around the IC package902. In particular, in the example of FIGS. 9A-B, the absorbing outfit910 is configured to form an opening for signal passage that is smallerand offset from the absorbing outfit of FIGS. 8A-8B. For example,absorbing outfit 910 can be shaped to aid in reflecting signal energyand directing signal propagation in a specified direction. Inparticular, the absorbing outfit 910 can makes a substantially rightangle after rising to a specified height above the PCB 904 on one sideof the IC package 902. From the specified height, the absorbing outfit910 extend over a portion of the IC package 902 such that only a portionis open as a channel to the housing portion 908. Opposite the overhang,the absorbing outfit 910 forms a wall to the housing portion 908 similarto that shown in FIG. 8A-B. The open portion can be positioned over atransducer 912 (shown in FIG. 9B) of the IC package 902. In alternativeimplementations, the overhanging portion can have an angle up toward thehousing or down toward the IC package.

The absorbing outfit 910 can be formed of a similar material to that ofabsorbing outfit 810 of FIGS. 8A-8B. The absorbing outfit 910 forms anopening for passage of signals. In some implementations, the edge of theopening formed by the absorbing outfit 910 is straight or may berecessed from the top surface of the absorbing outfit 910. The recesscan be straight, curved, slanted, or a combination.

FIG. 10A shows a side view diagram 1000 illustrating a third exampleabsorber signal isolation structure. FIG. 10B shows a top view diagram1001 illustrating the third example absorber signal isolation structureof FIG. 10A.

In particular, for ease of illustration a portion of a communicationmodule is shown having a single integrated circuit package andpositioned relative to a housing. In operation, the communication modulecan have one or more integrated circuit packages positioned on a commonPCB. The communication module can be positioned within a device relativeto a device housing such that signals can pass through the housing. Thedevice can be positioned relative to another device to communicate data,e.g., as illustrated in FIG. 4.

As shown in diagram 1000, an IC package 1002, for example a transmitterIC package, is positioned on a PCB 1004. The IC package 1002 is at leastpartially encircled by an absorbing outfit 1010. The absorbing outfit1010 forms a channel extending from the IC package 1002 to a surface ofa housing portion 1008.

The absorbing outfit 1010 is configured to aid in directing radiofrequency (RF) signals as well as to reduce interference from spurioussignals. For example, the absorbing outfit 810 can be shaped to aid inreflecting signal energy and directing signal propagation in a specifieddirection. The absorbing outfit 1010 can at least partially surround aperimeter of the IC package and extend in the direction of signaltransmission and/or reception by a specified “height” relative to thePCB 1004 to provide a channel for emitted or received RF signals.

In FIGS. 10A-10B, the absorbing outfit 1010 forms an absorptive wallaround the IC package 1002. In particular, in the example of FIGS.10A-B, the absorbing outfit 1010 is slanted such that the thickness ofthe absorbing outfit 1010 is greater near the PCB 1004 than near thehousing portion 1008.

The absorbing outfit 1010 is formed from a material that absorbselectromagnetic radiation, particularly radio frequency electromagneticradiation including EHF RF electromagnetic radiation. For example, theabsorbing outfit 1010 can be composed of a silica-ferrite material,e.g., a material formed by mixing small iron pieces with silicon. Insome implementations, the material is further selected based on heattolerance properties. For example, the material can be selected based inpart on a melting or deformation point in excess of temperaturesgenerated by device components. The absorbing outfit 1010 can have athickness configured to optimize the amount of stray signal absorptionand may depend on the particular absorbing material used and theproximity to another communication channel. In some otherimplementations, the absorbing outfit can have other shapes.

In each of the examples shown in FIGS. 8-10 above, the absorbing outfitis used without a distinct signal guiding structure and instead can actas both the absorbing outfit and signal guiding structure. However, insome implementations, the absorbing outfit of FIGS. 8-10 can be used incombination with a respective signal guiding structure that can besimilar to the signal guiding structure described above, e.g., withrespect to FIG. 3. For example, the absorbing outfit can surround aninner signal guiding structure that has a similar shape. When the signalguiding structure is used with the absorbing outfit, the signal guidingstructure should not be formed from or coated on an interior surfacewith a metallic material.

FIG. 11 shows a side view diagram 1100 illustrating a fourth exampleabsorber signal isolation structure.

In particular, for ease of illustration a portion of a communicationmodule is shown having a single integrated circuit package andpositioned relative to a housing. In operation, the communication modulecan have one or more integrated circuit packages positioned on a commonPCB. The communication module can be positioned within a device relativeto a device housing such that signals can pass through the housing. Thedevice can be positioned relative to another device to communicate data,e.g., as illustrated in FIG. 4.

As shown in diagram 1100, an IC package 1102, for example a transmitterIC package, is positioned on a PCB 1104. The IC package 1102 is at leastpartially encircled by a signal guiding structure 1106. The signalguiding structure 1106 forms a channel extending from the IC package1102 to a surface of a housing portion 1108.

The signal guiding structure, e.g., similar to signal guiding structure306 of FIG. 3, is configured to aid in directing radio frequency (RF)signals as well as to reduce interference from spurious signals. Thesignal guiding structure can at least partially surround a perimeter ofthe IC package and extend in the direction of signal transmission and/orreception by a specified “height” to provide a channel for emitted orreceived RF signals. The signal guiding structure can be composed of asuitable material that is configured to reduce extraneous signalswithout disrupting passage of communications along the channel formed bythe signal guiding structure. In particular, the signal guidingstructure 1106 should not be metallic.

An absorbing outfit can be positioned relative to communication units,e.g., an IC package, to absorb signals that might otherwise causecrosstalk to adjacent channels. In some implementations, the absorbingoutfit is placed around each IC package on a communication modulewhether it is a transmitter or a receiver. This, in combination with thesignal guiding structure, provides two layers of absorptive materialsfor absorbing stray signals.

In FIG. 11, an absorbing outfit 1110 forms an absorptive wall around theIC package 1102. For example, the absorbing outfit 1110 can surround thesignal guiding structure 1106. In particular, the absorbing outfit 1110can be substantially parallel to the signal guiding structure 1106 andcan be affixed to the signal guiding structure 1106 by a suitableaffixing structure or adhesive. When viewed from above, the signalguiding structure 1106 and the absorbing outfit 1110 can form concentricsquares surrounding the IC package 1102. The absorbing outfit 1110 canhave a thickness configured to optimize the amount of stray signalabsorption and may depend on the particular absorbing material used andthe proximity to another communication channel. In some alternativeimplementations, the absorbing outfit is positioned on an inside layerof the signal guiding structure such that the signal guiding structuresurrounds the absorbing outfit.

A number of embodiments of the invention have been described.Nevertheless, it will be understood that various modifications may bemade without departing from the spirit and scope of the invention.Accordingly, other embodiments are within the scope of the followingclaims.

While this specification contains many specific implementation details,these should not be construed as limitations on the scope of anyinvention or on the scope of what may be claimed, but rather asdescriptions of features that may be specific to particular embodimentsof particular inventions. Certain features that are described in thisspecification in the context of separate embodiments can also beimplemented in combination in a single embodiment. Conversely, variousfeatures that are described in the context of a single embodiment canalso be implemented in multiple embodiments separately or in anysuitable subcombination. Moreover, although features may be describedabove as acting in certain combinations and even initially be claimed assuch, one or more features from a claimed combination can in some casesbe excised from the combination, and the claimed combination may bedirected to a subcombination or variation of a subcombination.

Similarly, while operations are depicted in the drawings in a particularorder, this should not be understood as requiring that such operationsbe performed in the particular order shown or in sequential order, orthat all illustrated operations be performed, to achieve desirableresults. In certain circumstances, multitasking and parallel processingmay be advantageous. Moreover, the separation of various system modulesand components in the embodiments described above should not beunderstood as requiring such separation in all embodiments, and itshould be understood that the described program components and systemscan generally be integrated together in a single software product orpackaged into multiple software products.

Particular embodiments of the subject matter have been described. Otherembodiments are within the scope of the following claims. For example,the actions recited in the claims can be performed in a different orderand still achieve desirable results. As one example, the processesdepicted in the accompanying figures do not necessarily require theparticular order shown, or sequential order, to achieve desirableresults. In some cases, multitasking and parallel processing may beadvantageous.

1. (canceled)
 2. An apparatus comprising: an integrated-circuit (IC) package including a transducer coupled to at least one of a transmitter, a receiver, or a transceiver, the IC package mounted to the PCB; and a metallic blocking structure configured to partially enshroud the IC package, the metallic blocking structure having at least a first portion that covers a portion of the IC package and is oriented substantially parallel to the printed circuit board, wherein the first portion is positioned to provide an opening disposed over and that exposes the transducer.
 3. The apparatus of claim 2, wherein the metallic blocking structure forms a channel for passing electromagnetic signals.
 4. The apparatus of claim 3, wherein the channel is formed above the transducer.
 5. The apparatus of claim 2, wherein the metallic blocking structure is shaped to direct signal propagation in a specified direction.
 6. The apparatus of claim 2, wherein the metallic blocking structure has an asymmetrical horn shape.
 7. An apparatus comprising: a printed circuit board (PCB); an integrated-circuit (IC) package including a transducer coupled to at least one of a transmitter, a receiver, or a transceiver, the IC package mounted to the PCB; and an absorber structure configured to partially enshroud the IC package, the absorber structure having at least a first portion that covers a portion of the IC package and is oriented substantially parallel to the printed circuit board, wherein the first portion is positioned to provide an opening disposed over and that exposes the transducer.
 8. The apparatus of claim 7, wherein the absorber structure forms a channel for passing electromagnetic signals.
 9. The apparatus of claim 8, wherein the channel is formed above the transducer.
 10. The apparatus of claim 7, wherein the absorber structure is shaped to direct signal propagation in a specified direction.
 11. The apparatus of claim 7, wherein the absorber structure has an asymmetrical horn shape. 